讲授未央书院本科生必修课程电力电子器件与应用

讲授电机系本科生必修课程电力电子技术基础

2026-2030，2030国家科技重大专项课题负责人

2025-2026，基于人工智能的宽禁带功率半导体建模分析与参数提取方法，广东重点实验室项目，中国

2025-2026，功率器件封装技术与电-磁-热仿真辅助开发，南网科技公司，中国

2026-2027，配电网低成本磁控柔性互联技术，南网科研院，中国

2025-2027，高性能磁控调压技术及装备，北京电科院，中国

2025-2026，柔性配网的低成本调压变压器，山东电科院，中国

2024-2026，高可靠磁控无极调压配电变压器装备研究及示范应用，广东中鹏电气有限公司，中国

2024-2026，磁控无级调压配变拓扑与调控技术研究，南网科研院，中国

2024-2026，清华大学-南网科技公司联合研究中心

2023-2026，多端口电力电子变压器解耦控制与振荡抑制研究，国家自然科学基金面上项目，中国

2023-2026，高压大功率可关断器件驱动芯片关键技术，国家重点研发计划（课题5），中国

2021-2022, 兆瓦级多端口电力电子变压器，汇川技术，中国

2021-2022, IGBT功率模块可靠性评估，上海三菱电梯，中国

2021-2022, 75kW多功能三端口电力电子变压器，山东电科院，中国

2020-2021, 交直流混合的分布式可再生能源关键技术、核心装备和工程示范研究，国家重点研发计划（课题3），中国

2020-2023, SiC Based Modular Transformer-less MW-Scale Power Conditioning System and Control for Flexible Manufacturing Plants, Department of Energy, 美国

2018-2021, SiC based modular transformer-less MW-scale power conditioning system and control for flexible CHP system, Department of Energy, 美国

2017-2020, Multi-functional high-efficiency high-density medium voltage SiC based asynchronous microgrid power conditioning system module, Power America, 美国

2014-2017, Agile direct grid connection medium voltage 4.7-12.47 kV power converter for PV applications utilizing advanced WBG devices, Department of Energy, 美国

2016, Benchmark of Benefits of High Voltage SiC in Medium Voltage Power Distribution Grids, Oak Ridge National Laboratory, 美国

2016-2017, Topology Evaluation of Aircraft Electric Power Distribution System, Safran Company, 法国

https://thurid.lib.tsinghua.edu.cn/scholar/29118463

国际期刊论文选

1)M. Yang, Y. Xiao, S. Ji, W. Xie, Z. Zhao, C. Sheng, W. Yang, “Stray inductance extraction methods for power modules: a comprehensive review and analysis”, IEEE Trans. Power Electron., vol. 40, no. 2, pp. 8016-8035, Jan. 2025.

2)Y. Xiao, S. Ji, M. Yang, Z. Zhao, “An easy-to-implement flexible commutation design with reduced switching losses, di/dt and dv/dt for high-speed and high-power IGBTs,”IEEE Trans. Power Electron., vol. 40, no. 9, Sept. 2025.

3)H. Wang, S. Ji, D. Mou, W. Xie, Y. Zeng, Z. Zhao, “High-frequency-link-based reactive-power optimal control for modular multi-acitve bridge,”IEEE Journal of Emerging and Selected Topics in Industrial Electronics, vol. 5, no. 3, 2024.

4)H. Wang, Y. Zeng, S. Ji, Z. Zhao, L. Yuan, X. Mo, “ZVS soft switching operation region analysis of modular multi active bridge converter under single phase shift control,”IEEE Trans. Ind. Electron., vol. 70, no. 7, 2023.

5)J. Zheng, Y. Zeng, Z. Zhao, W. Liu, H. Xu, S.Ji, “A semi-implicit parallel leapfrog solver with half-step sampling technique for FPGA-based real-time HIL simulation of power converters,”IEEE Trans. Ind. Electron., vol. 71, no. 3, 2024.

6)R. Chen, F. Wang, L. Tolbert, X. Huang, D. Li, C. Nie, M. Lin, S. Ji, L. Zhang, “10kV SiC MOSFET based medium voltage power conditioning system for asynchronous microgrid,” IEEE Access, vol. 10, 2022.

7)J. Zheng, Z. Zhao, Y. Zeng, S. Ji, L. Yuan, “An event-driven parallel acceleration real-time simulation for power electronic systems without simulation distortion in circuit partitioning,” IEEE Trans. Power Electron., vol. 37, no. 12, 2022.

8)H. Wang, S. Ji, D. Mou, L. Yuan, Y. Zeng, Z. Zhao, “Switching characterization and power loss optimization for mofular multiactive bridge converter under common phase shift control,”IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 11, no. 4, 2023.

9)H. Wang, D. Mou, S. Ji, L. Yuan, Y. Zeng, J. Zheng, Z. Zhao, “Universal phase-shift modulation scheme and efficiency optimization for modular multiactive bridge converter,” IEEE Trans. Ind. Electron., vol. 71, no. 7, 2024.

10)Y. Zeng, J. Zheng, Z. Zhao, W. Liu, S. Ji, H. Li, “Real-time digital mapped method for sensorless multitimescale operation condition monitoring of power electronics systems,”IEEE Trans. Ind. Electron., vol. 71, no. 4, 2024.

11)H. Li, Z. Gao, F. Wang, Y. Ma, Y. Su, D. Li, P. Yao, S. Ji, Z. Yang, R. Chen, “Design, development, and testing of a flexible combined heat and power (F-CHP) system with 10kV SiC MOSFET-based power conditioning system (PCS) converter,” IEEE Access, vol. 11, 2023.

12)Y. Zeng, Z. Zhao, J. Zheng, H. Li, S. Ji, L. Yuan, “A self-restoring fault-tolerant method for controller cooperation simulation of power electronics systems,” IEEE Trans. Ind. Electron., vol. 71, no. 1, 2024.

13)H. Li, Z. Gao, S. Ji, Y. Ma, F. Wang, “An inrush current limiting method for grid-connected converters considering grid voltage disturbances,” IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 10, no. 2, pp. 2608-2618, Apr. 2022.

14)X. Huang, S. Ji, C. Nie, D. Li, M. Lin, L. Tolbert, F. Wang, W. Giewont, “Comprehensive analysis and improvement methods of noise immunity of desat protection for high voltage SiC MOSFETs with high dv/dt,” IEEE Open Journal of Power Electronics, vol. 3, pp. 36-50, Dec. 2021.

15)B. Shi, S. Ji, Z. Zhao, Z. Yu, “Discrete-State Event-Driven Numerical Prototyping of Megawatt Solid-State Transformers and AC/DC Hybrid Microgrids,” IEEE Access, vol. 9, pp. 108329-108339, Jul. 2021.

16)S. Ji, X. Huang, J. Palmer, F. Wang, L. Tolbert, “Modular multilevel converter (MMC) modeling considering submodule voltage sensor noise,” IEEE Trans. Power Electron., vol. 36, no. 2, pp. 1215-1219, Feb. 2021.

17)S. Ji, L. Zhang, X. Huang, J. Palmer, F. Wang, L. Tolbert, “A novel voltage balancing control with dv/dt reduction for 10-kV SiC MOSFET-based medium voltage modular multilevel converter,” IEEE Trans. Power Electron., vol. 35, no. 11, pp. 12533-12543, Nov. 2020.

18)L. Zhang, S. Ji, S. Gu, X. Huang, J. Palmer, W. Giewont, F. Wang, L. Tolbert, “Design considerations for high-voltage-insulated gate drive power supply for 10-kV SiC MOSFET applied in medium-voltage converter,” IEEE Trans. Ind. Electron., vol. 68, no. 7, pp. 5712-5724, Jul. 2021.

19)P. Yao, X. Jiang, P. Xue, S. Ji, F. Wang, “Flux balancing control of ungapped nanocrystalline core-based transformer in dual active bridge converters,” IEEE Trans. Power Electron., vol. 35, no. 11, pp. 11463-11474, Nov. 2020.

20)S. Ji, F. Wang, L. Tolbert, T. Lu, Z. Zhao, H. Yu, “An FPGA based voltage balancing control for multi HV-IGBTs in series connection,” IEEE Trans. on Ind. Appl., vol. 54, no. 5, pp. 4640-4649, Sep. 2018.

21)S. Ji, M. Laitinen, X. Huang, J. Sun, W. Giewont, F. Wang, L. Tolbert, “Short circuit characterization and protection of 10 kV SiC MOSFET,” IEEE Trans. Power Electron., vol. 34, no. 2, pp. 1755-1764, Feb. 2019.

22)B. Shi, Z. Zhao, K. Li, G. Feng, S. Ji, J. Zhou, “Design methodology for optimal phase-shift modulation of non-inverting buck-boost converter,” Journal of Power Electronics., vol. 19, no. 5, pp. 1108-1121, Sep. 2019.

23)S. Ji, S. Zheng, F. Wang, L. M. Tolbert, “Temperature-dependent characterization, modeling and switching speed limitation analysis of third generation 10 kV SiC MOSFET,” IEEE Trans. Power Electron., vol. 33, no. 5, pp. 4317-4327, May. 2018.

24)S. Ji, T. Lu, Z. Zhao, H. Yu, L. Yuan, “Series-connected HV-IGBTs using active voltage balancing control with status feedback circuit,” IEEE Trans. Power Electron., vol. 30, no. 8, pp. 4165-4174, Aug. 2015.

25)S. Ji, T. Lu, Z. Zhao, H. Yu, L. Yuan, S. Yang, C. Secrest, “Physical model analysis during transient for series connected HVIGBTs,” IEEE Trans. Power Electron., vol. 29, no. 11, pp. 5727-5737, Nov. 2014.

26)T. Lu, Z. Zhao, H. Yu, S. Ji, L. Yuan, F. He. “Parameter design of three-level converter based on series connected HV-IGBTs,” IEEE Trans. on Ind. Appl., vol. 50, no. 6, pp. 3943-3954, Nov. 2014.

27)T. Lu, Z. Zhao, S. Ji, H. Yu, L. Yuan. “Active clamping circuit with status feedback for series-connected HV-IGBTs,” IEEE Trans. on Ind. Appl., vol. 50, no. 5, pp. 3579-3590, Sep. 2014.

28)S. Ji, Z. Zhao, T. Lu, L. Yuan, H. Yu. “HVIGBT physical model analysis during transient,” IEEE Trans. Power Electron., vol. 28, no. 5, pp. 2616-2624, May. 2013.

国际会议论文选

1)D. Li, X. Huang, S. Ji, C. Nie, F. Wang, L. Tolbert, “Controller design and implementation of a medium voltage (13.8 kV) modular multi-level converter for asynchronous microgrids,” IEEE Energy Conversion Congress and Exposition (ECCE), 2020, Detroit, MI.

2)X. Huang, S. Ji, D. LI, C. Nie, L. Tolbert, F. Wang, W. Giewont, “Analysis and gate driver design considerations of 10 kV SiC MOSFETs under flashover fault due to insulation failure,” IEEE Energy Conversion Congress and Exposition (ECCE), 2020, Detroit, MI.

3)X. Huang, S. Ji, D. Li, C. Nie, W. Giewont, L. Tolbert, F. Wang, “A test scheme for the comprehensive qualification of MMC submodule based on 10 kV SiC MOSFETs under high dv/dt,” European Conference on Power Electronics and Applications (EPE), 2020, Lyon, France.

4)S. Ji, J. Palmer, X. Huang, D. Li, W. Giewont, L. Tolbert, F. Wang, “Impact of submodule voltage sensor noise in 10 kV SiC MOSFET modular multilevel converters (MMCs) under high dv/dt environment,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 1089-1093.

5)D. Li, S. Ji, X. Huang, J. Palmer, F. Wang, L. Tolbert, “Controller development of an asynchronous microgrid power conditioning system (PCS) converter considering grid requirements,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 616-621.

6)J. Palmer, S. Ji, X. Huang, L. Zhang, W. Giewont, F. Wang, L. Tolbert, “Improving voltage sensor noise immunity in a high voltage and high dv/dt environment,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 107-113.

7)X. Huang, S. Ji, J. Palmer, L. Zhang, D. Li, F. Wang, L. Tolbert, W. Giewont, “A robust 10 kV SiC MOSFET gate driver with fast overcurrent protection demonstrated in a MMC submodule,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 1813-1820.

8)S. Ji, X. Huang, J. Palmer, L. Zhang, W. Giewont, F. Wang, L. Tolbert, “Medium Voltage (13.8 kV) Transformer-less Grid-Connected DC/AC Converter Design and Demonstration Using 10 kV SiC MOSFET with High Frequency,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 1953-1959.

9)J. Palmer, S. Ji, X. Huang, L. Zhang, F. Wang, W. Giewont, L. Tolbert, “Testing and validation of 10 kV SiC MOSFET based 35 kVA MMC phase-leg for medium voltage (13.8 kV) grid,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 2001-2006.

10)X. Huang, J. Palmer, S. Ji, L. Zhang, F. Wang, L. Tolbert, W. Giewont, “Design and testing of a modular multilevel converter submodule based on 10 kV SiC MOSFETs,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 1926-1933.

11)L. Zhang, S. Ji, X. Huang, J. Palmer, W. Giewont, F. Wang, L. Tolbert, “Multiple-step commutation scheme for avoiding high dv/dt in modular multilevel converter with 10 kV SiC MOSFET,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 1968-1973.

12)L. Zhang, S. Ji, S. Gu, X. Huang, J. Palmer, W. Giewont, F. Wang, L. Tolbert, “Design considerations of high-voltage-insulation gate driver power supply for 10 kV SiC MOSFET in medium-voltage application,” in IEEE Applied Power Electronics Conference and Exposition (APEC), 2019, Anaheim, CA, pp. 425-430.

13)X. Huang, S. Ji, J. Palmer, L. Zhang, L. Tolbert, F. Wang, “Parasitic capacitor’s impact on switching performance in a 10 kV SiC MOSFET based converter,” IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2018, Atlanta, GA, pp. 311-318.

14)X. Huang, S. Ji, J. Sun, S. Zheng, F. Wang, L. Tolbert, M. Laitinen, W. Giewont, “Impact of Body Diode and Anti-parallel J B S Diode on Switching Performance of 3rd Generation 10 kV SiC MOSFET,” IEEE Energy Conversion Congress and Exposition (ECCE), 2018, Portland, OR, pp. 1887-1894.

15)S. Ji, M. Laitinen, X. Huang, J. Sun, W. Giewont, L. Tolbert, F. Wang, “Short circuit characterization of 3rd generation 10 kV SiC MOSFET,” in IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, 2018.

16)S. Ji, X. Shi, Z. Zhang, W. Cao, F. Wang, “Benefits of high voltage SiC applications in medium voltage power distribution grids,” in International Conference on Silicon Carbide and Related Materials (ICSCRM), Washington, D.C., 2017.

学术组织任职

IEEE Senior Member

IEEE PELS北京分会Leadership Committee member

IEEE PELS会员

IEEE ITRW成员

中国机械工业教育协会学科专业教学委员会委员

中国电源学会会员发展工作委员会委员

中国电源学会电磁兼容专业委员会委员

中国电源学会教育与培训工作委员会委员

国际期刊编委

IEEE TPEL Associate Editor

IEEE JESTPE Guest Editor

CJEE Guest Editor

CES TEMS Frontier Editor-in-chief

Engineering Reports Associate Editor

I-Energy Associate Editor

国际会议任职

IEEE Wipda-Asia 2025 Local Chair

IEEE ECCE 2025 Session Chair

IEEE ECCE 2024 Sessior Chair

IEEE ECCE-Asia 2022 Session Chair

IEEE Wipda-Asia 2021 TPC member、Session Chair